Driven by demand for AI, High Bandwidth Memory (HBM) has become a core pillar of AI computing power thanks to its ultra-high bandwidth, exceptional energy efficiency, and compact size. Currently, there are two mainstream methods for HBM bonding: D2W (Die-to-Wafer) and W2W (Wafer-to-Wafer). D2W (Die-to-Wafer) is a heterogeneous integration process in which wafers are first diced and good bare dies are sorted, after which the dies are picked up one by one and mounted onto a target wafer; Wafer-to-Wafer (W2W) is a batch-processing, homogeneous integration process in which two complete wafers are bonded face-to-face before dicing. FCM provides the corresponding core components for both of these HBM bonding process equipment types.

I.Core Components for D2W Process Equipment—Pulse Heater

Pulse Heater: As the core power source for thermal compression bonding (TCB), it enables high-precision, low-damage interconnections in HBM chip stacking through millisecond-level temperature control, serving as the key engine for advanced packaging processes.

II. Core Components for D2W Process Equipment—Vacuum Heating Vacuum Chuck

Vacuum Heating Suction Cup: As the key support unit in TCB equipment, it eliminates wafer warpage through vacuum suction, providing a bonding interface with micron-level flatness. Simultaneously, acting as a heat source, it provides a precise and uniform preheating environment for the wafer, ensuring bonding yield and reliability.

III. Core Tooling for D2W Process Equipment—Bonding Nozzles

SiC Suction Nozzles: Utilizing the principle of vacuum suction to hold the die, these nozzles can be used in combination with bonding hot press heads to enable bonding compatible with multiple die sizes.

IV. Core Component of W2W Process Equipment—Aluminum Nitride Electrostatic Chuck

Aluminum Nitride Electrostatic Heating Chuck: With its excellent thermal conductivity and chemical stability, it serves as the cornerstone for achieving precise wafer temperature control in semiconductor manufacturing.