AIN Ceramic Heater - AlN Ceramic Heater - Fine Ceramic New Material Co.,Ltd

Aluminum nitride is a multifunctional material, most commonly used in scenarios that require high thermal conductivity and electrical insulation. This unique ability makes AIN an ideal choice for fast heating and heat dissipation. Such as aluminum nitride ceramic heaters, aluminum nitride ceramic wafer trays / ceramic chucks, etc.

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Product Introduction

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Four main advantages

Thermal Conductivity

The thermal conductivity is 10 times compare to alumina ceramics, and the thermal conductivity is close to that of metal aluminum;
Fast heating rate: 600℃ within 6 seconds at room temperature of 25℃;
Good temperature uniformity: temperature difference within ±5℃.

Strength

Strength: flexural strength 310-350 MPA;
Hardness: HRA 89;
Volume resistivity: >10¹³ Ω.cm.

Stability

Stability: the melting point of aluminum nitride ceramics is 2450℃, and it has good stability in high-temperature non-oxidizing atmosphere within 2000℃.

Dielectric Constant

Excellent dielectric constant and low dielectric loss.

Main Applications

Size: Ø5, Ø9×34, Ø50 mm (customizable)

Semi-conductor: ESC, etch, CVD, polishing machine;
Medical Devices: heating and atomization;
Other: used in other scenarios that require fast heating rate and good temperature uniformity.

Material Parameters

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Ceramic Types	Density (g/cm³)	Bending Strength (Mpa)	Fracture Toughness (Mpa.m^1/2)	Dry Burning Power Density (W/cm²)	Thermal Shock Resistance（℃）	Coefficient of Expansion (10^-6/°C)	Thermal Conductivity (W/m.k)	Operation Temperature (℃)
Aluminum Nitride	3.2-3.4	310-500	3.5~4.5	96 (Load up to 160）	500	4-5	170-260 （Theory 320）	1200
Silicon Nitride	3.0-3.4	600-1000	4-7	25	400-800	2.6-3.9	20-25	1400
95 Alumina	3.7-3.8	280-300	3-4	10	220	6-8	18-35	1100

Ceramic Types

Density
(g/cm³)

Bending
Strength (Mpa)

Fracture
Toughness
(Mpa.m^1/2)

Dry Burning
Power
Density (W/cm²)

Thermal Shock
Resistance（℃）

Coefficient of
Expansion
(10^-6/°C)

Thermal
Conductivity
(W/m.k)

Operation
Temperature (℃)

Aluminum Nitride

3.2-3.4

310-500

3.5~4.5

(Load up to 160）

500

4-5

170-260
（Theory 320）

1200

Silicon Nitride

3.0-3.4

600-1000

4-7

400-800

2.6-3.9

20-25

1400

95 Alumina

3.7-3.8

280-300

3-4

220

6-8

18-35

1100

Performance Parameters

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ltem
Room Temperature Flexural Strength	≥320 Mpa
Bulk Density	3.20-3.4 g/cm³
Room Temperature Relative Dielectric Constant	8.8-8.9
Coefficient of Thermal Expansion	4.5x10^-6/℃
Dry Burning Power Density	96 W/cm²
Room Temperature Fracture Toughness	4.5 Mpa.m^1/2
Room Temperature Volume Resistivity	>10¹³Ω.cm
Thermal Conductivity	170-260 W/ (m-k)
Hardness	HRA 89
Load Power Density	160 W/cm²